DuPont™ Vespel® CR-6110 for Semiconductor Wafer Handling End Effectors

A manufacturer of semiconductor machinery was developing a new end effector for a wafer handling robot. Chemical resistance, ESD protection, and dimensional stability were all critical to quality for the application. They considered several materials including ceramics and various thermoplastics. During initial testing, ceramics were determined to be too brittle for the application. Fluoropolymers including PTFE and PFA changed shape due to thermal expansion and flexural creep strain. They also increased risk of ESD damage during handling.

Curbell Plastics Solution

Curbell’s technical team worked with the engineering group to evaluate DuPont™ Vespel® CR-6110 PFA/carbon fiber composite for the application. The material had the durability, dimensional stability, and creep resistance required for the end effector. DuPont™ Vespel® CR-6110 also had low enough surface resistivity to reduce the likelihood of damage from electrostatic discharge during handling. The chemical resistance and purity of the material allowed it to be compatible with incidental contact with the strong acids used in the process.

Benefits of DuPont™ Vespel® CR-6110 for Wafer Handling Applications:

• Superior resistance to many semiconductor wet process chemicals
• Ultra-high purity
• Low levels of metallic ion extractables
• High strength and modulus
• Creep resistance
• Dimensional stability
• Excellent wear characteristics
• High operating temperature

To learn more about DuPont™ Vespel® CR-6110 and its use in semiconductor manufacturing equipment, explore the following resources:

• White Paper: Bridging the Performance Gap with DuPont™ Vespel® CR-6110 for High-Purity Semiconductor Applications
• Article: DuPont™ Vespel® CR-6110 PFA/Carbon Fiber Composite for Semiconductor Wet Processing and Wafer Handling Applications