DuPont™ Vespel® CR-6110
PFA carbon fiber composite offers chemical resistance, dimensional stability, purity and a high operating temperature
About DuPont™ Vespel® CR-6110
DuPont™ Vespel® CR-6110 is a carbon fiber-reinforced PFA composite designed for use in harsh semiconductor wet processing chemistries. The material has outstanding strength, modulus, creep resistance, and dimensional stability. It is resistant to a wide range of chemicals that are used for cleaning and etching semiconductor wafers including solvents, bases, and certain concentrations of hydrofluoric acid and sulfuric acid/hydrogen peroxide mixtures.
Vespel® CR-6110 is formulated with conductive additives to reduce the likelihood of damage to semiconductor wafers due to electrostatic discharge. Vespel® CR-6100 has long wear life and it has low abrasion on the surfaces of semiconductor wafers compared with traditional glass-filled composites.
Vespel® CR-6110 has outstanding purity characteristics, with low levels of metallic ion extractables when immersed in high purity semiconductor fluids. The material has good machinability, allowing for tight dimensional tolerances and smooth machined surfaces.
Users of Vespel® CR-6110 have reported that it demonstrates excellent thermal resistance at 260°C (500°F) in their applications. It is often specified for applications that require chemical resistance and superior mechanical properties at elevated temperatures.
Length, width, thickness, and diameter tolerances vary by size, by manufacturer, brand, and grade. Vespel® CR-6110 is also available in rings.
Mechanical Properties
Thermal Properties
Other Properties
The information set forth herein is furnished free of charge, is based on technical data that DuPont believes to be reliable, and represents typical values that fall within the normal range of properties. This information relates only to the specific material designated and may not be valid for such material used in combination with other materials or in other processes. It is intended for use by persons having technical skill, at their own discretion and risk. This information should not be used to establish specification limits nor used alone as the basis of design. Handling precaution information is given with the understanding that those using it will satisfy themselves that their particular conditions of use present no health or safety hazards and comply with applicable law. Since conditions of product use and disposal are outside our control, we make no warranties, express or implied, and assume no liability in connection with any use of this information. As with any product, evaluation under end-use conditions prior to specification is essential. Nothing herein is to be taken as a license to operate or a recommendation to infringe on patents.
CAUTION: Do not use DuPont materials in medical applications involving implantation in the human body or contact with internal body fluids or tissues unless the material has been provided from DuPont under a written contract that is consistent with the DuPont policy regarding medical applications and expressly acknowledges the contemplated use. For further information, please contact your DuPont representative. Learn more.
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