Semiconductor test sockets need to have good mechanical properties and excellent wear characteristics so that they will maintain their dimensions for many cycles of use.
Test socket applications may require plastics that can operate at temperatures ranging from as low as -55 °C to as high as 155 °C (-67 °F to 311 °F). The plastics specified for these applications need to have low particulate generation and low outgassing to minimize contamination of the IC chips during testing.
The plastics used for test sockets also need to have good machinability, low moisture absorption, low rates of thermal expansion, and excellent dimensional stability so that tight pitch, small diameter holes can be cleanly and precisely drilled into the material.
Some semiconductor test socket applications require materials with specific electrical properties such as low dielectric constants, low dissipation factors, or the ability to dissipate static electricity.
Curbell supplies a number of different materials for semiconductor test sockets as shown the table below. Datasheets for the materials can be viewed by following the links in the trade names at the top of the table.
Plastic materials for semiconductor test sockets properties TABLE
| |
PPS |
ULTEM® |
ULTEM® |
| |
TECATRON® PPS |
TECAPEI®
(Ultem® 1000) |
TECAPEI® GF30
(Ultem® 2300 - 30%
Glass Filled)
|
| Filler |
Unfilled |
Unfilled |
Glass |
| Tensile Strength per ASTM D638 / ISO 527-1 (psi) |
13,700 |
17,500 |
18,000 |
| Tensile Elongation per ASTM D638 / ISO 527-1 (%) |
2.5 |
40 |
3.0 |
| Tensile Modulus per ASTM D638 / ISO 527-1 (kpsi) |
837 |
430 |
800 |
| Flexural Modulus per ASTM D790 (kpsi) |
631 |
480 |
800 |
| HDT @ 264 psi per ASTM D648 (°F) |
220 |
394 |
409 |
| Water Absorption, 24 hours (%) |
0.01 |
0.25 |
0.16 |
| Water Absorption at Saturation (%) |
– |
1.25 |
0.90 |
| CLTE (in/in/°F x 10-5) |
3.3 |
3.1 |
1.1 |
| |
PEEK |
PEEK |
PEEK |
PEEK |
| |
TECAPEEK® |
TECAPEEK® GF30
(30% Glass
Filled PEEK) |
TECAPEEK® CMF |
EtroX® V |
| Filler |
Unfilled |
Glass |
Ceramic |
Proprietary |
| Tensile Strength per ASTM D638 / ISO 527-1 (psi) |
16,000 |
15,000 |
15,229 |
15,229 |
| Tensile Elongation per ASTM D638 / ISO 527-1 (%) |
30 |
2.2 |
4.0 |
2.5 |
| Tensile Modulus per ASTM D638 / ISO 527-1 (kpsi) |
650 |
1,000 |
798 |
769 |
| Flexural Modulus per ASTM D790 (kpsi) |
600 |
1,000 |
798 |
– |
| HDT @ 264 psi per ASTM D648 (°F) |
320 |
600 |
572 |
– |
| Water Absorption, 24 hours (%) |
0.10 |
0.10 |
0.06 |
– |
| Water Absorption at Saturation (%) |
0.50 |
.30 |
– |
0.15 |
| CLTE (in/in/°F x 10-5) |
2.5 |
1.2 |
3.1 |
2.7 |
| |
PAI |
PAI |
PAI |
PAI |
| |
Duratron® T4203 PAI |
Duratron® T5030 PAI |
TECAPAI® CM XP403
(made from Torlon® Resin) |
TECAPAI® CM XP530
(made from Torlon® Resin) |
| Filler |
Unfilled |
Glass |
Unfilled |
Glass |
| Tensile Strength per ASTM D638 / ISO 527-1 (psi) |
20,000 |
16,000 |
17,700 |
16,700 |
| Tensile Elongation per ASTM D638 / ISO 527-1 (%) |
10 |
4.0 |
6.4 |
3.2 |
| Tensile Modulus per ASTM D638 / ISO 527-1 (kpsi) |
600 |
1,000 |
537 |
900 |
| Flexural Modulus per ASTM D790 (kpsi) |
600 |
980 |
567 |
890 |
| HDT @ 264 psi per ASTM D648 (°F) |
532 |
530 |
494 |
515 |
| Water Absorption, 24 hours (%) |
0.40 |
0.30 |
0.20 |
0.20 |
| Water Absorption at Saturation (%) |
1.70 |
– |
1.70 |
1.80 |
| CLTE (in/in/°F x 10-5) |
1.7 |
0.9 |
2.15 |
1.76 |
| |
Polyimide |
Polyimide |
| |
DuPont™ Vespel® SP-1 |
DuPont™ Vespel® SCP-5000 |
| Filler |
Unfilled |
Unfilled |
| Tensile Strength per ASTM D638 / ISO 527-1 (psi) |
12,500 |
23,600 |
| Tensile Elongation per ASTM D638 / ISO 527-1 (%) |
7.5 |
7.5 |
| Tensile Modulus per ASTM D638 / ISO 527-1 (kpsi) |
– |
– |
| Flexural Modulus per ASTM D790 (kpsi) |
450 |
836 |
| HDT @ 264 psi per ASTM D648 (°F) |
– |
– |
| Water Absorption, 24 hours (%) |
0.24 |
0.08 |
| Water Absorption at Saturation (%) |
– |
– |
| CLTE (in/in/°F x 10-5) |
3.0 |
2.6 |
For certain test socket applications, static electricity protection is required. Information on Curbell’s ESD plastics can be accessed by following the link to Curbell’s ESD Plastic Materials Properties Table.
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