Test Sockets

High performance polymers with the strength and dimensional stability required for test sockets

Semiconductor test sockets need to have good mechanical properties and excellent wear characteristics so that they will maintain their dimensions for many cycles of use.

Test socket applications may require plastics that can operate at temperatures ranging from as low as -55 °C to as high as 155 °C (-67 °F to 311 °F). The plastics specified for these applications need to have low particulate generation and low outgassing to minimize contamination of the IC chips during testing.

The plastics used for test sockets also need to have good machinability, low moisture absorption, low rates of thermal expansion, and excellent dimensional stability so that tight pitch, small diameter holes can be cleanly and precisely drilled into the material.

Some semiconductor test socket applications require materials with specific electrical properties such as low dielectric constants, low dissipation factors, or the ability to dissipate static electricity.

Curbell supplies a number of different materials for semiconductor test sockets as shown the table below.

Plastic materials for semiconductor test sockets properties TABLE
  PPS ULTEM® ULTEM®
  TECATRON® PPS TECAPEI®
(Ultem® 1000)

TECAPEI® GF30
(Ultem® 2300 - 30%
Glass Filled)
 
Filler Unfilled Unfilled Glass
Tensile Strength per ASTM D638 / ISO 527-1 (psi) 13,700 17,500 18,000
Tensile Elongation per ASTM D638 / ISO 527-1 (%) 2.5 40 3.0
Tensile Modulus per ASTM D638 / ISO 527-1 (kpsi) 837 430 800
Flexural Modulus per ASTM D790 (kpsi) 631 480 800
HDT @ 264 psi per ASTM D648 (°F) 220 394 409
Water Absorption, 24 hours (%) 0.01 0.25 0.16
Water Absorption at Saturation (%) 1.25 0.90
CLTE (in/in/°F x 10-5) 3.3 3.1 1.1
  PEEK PEEK PEEK PEEK
  TECAPEEK® TECAPEEK® GF30
(30% Glass
Filled PEEK)

TECAPEEK® CMF

EtroX® V
Filler Unfilled Glass Ceramic Proprietary
Tensile Strength per ASTM D638 / ISO 527-1 (psi) 16,000 15,000 15,229 15,229
Tensile Elongation per ASTM D638 / ISO 527-1 (%) 30 2.2 4.0 2.5
Tensile Modulus per ASTM D638 / ISO 527-1 (kpsi) 650 1,000 798 769
Flexural Modulus per ASTM D790 (kpsi) 600 1,000 798
HDT @ 264 psi per ASTM D648 (°F) 320 600 572
Water Absorption, 24 hours (%) 0.10 0.10 0.06
Water Absorption at Saturation (%) 0.50 .30 0.15
CLTE (in/in/°F x 10-5) 2.5 1.2 3.1 2.7
  PAI PAI PAI PAI
  Duratron® T4203 PAI Duratron® T5030 PAI
TECAPAI® CM XP403
(made from Torlon® Resin)

TECAPAI® CM XP530
(made from Torlon® Resin)
Filler Unfilled Glass Unfilled Glass
Tensile Strength per ASTM D638 / ISO 527-1 (psi) 20,000 16,000 17,700 16,700
Tensile Elongation per ASTM D638 / ISO 527-1 (%) 10 4.0 6.4 3.2
Tensile Modulus per ASTM D638 / ISO 527-1 (kpsi) 600 1,000 537 900
Flexural Modulus per ASTM D790 (kpsi) 600 980 567 890
HDT @ 264 psi per ASTM D648 (°F) 532 530 494 515
Water Absorption, 24 hours (%) 0.40 0.30 0.20 0.20
Water Absorption at Saturation (%) 1.70 1.70 1.80
CLTE (in/in/°F x 10-5) 1.7 0.9 2.15 1.76
  Polyimide Polyimide
  DuPont™ Vespel® SP-1 DuPont™ Vespel® SCP-5000
Filler Unfilled Unfilled
Tensile Strength per ASTM D638 / ISO 527-1 (psi) 12,500 23,600
Tensile Elongation per ASTM D638 / ISO 527-1 (%) 7.5 7.5
Tensile Modulus per ASTM D638 / ISO 527-1 (kpsi)
Flexural Modulus per ASTM D790 (kpsi) 450 836
HDT @ 264 psi per ASTM D648 (°F)
Water Absorption, 24 hours (%) 0.24 0.08
Water Absorption at Saturation (%)
CLTE (in/in/°F x 10-5) 3.0 2.6

For certain test socket applications, static electricity protection is required. Information on Curbell’s ESD plastics can be accessed by following the link to Curbell’s ESD Plastic Materials Properties Table.

Which plastic materials are right for your application? Contact us today.

Looking for plastic materials that have the strength, wear resistance, and dimensional stability required for semiconductor test sockets? Whatever you need, our plastics experts are here for you—ready to answer your technical questions and discuss material options.

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Frequently Asked Questions
Which plastic materials are the most dimensionally stable?

Machined plastics parts can change in size and shape due to a number of factors including moisture absorption, thermal expansion, and residual stress.  Certain materials such as DuPont™ Vespel® and filled grades of PEEK are exceptionally stable.

Are there plastic materials available that have ESD properties?

There are a number of ESD plastic materials that can be considered for test socket applications including ESD grades of DuPont™ Vespel® polyimide, Semitron® PAI, and PEEK.

Which plastic materials can be used at elevated temperatures?

PEEK, Ultem®, Torlon® PAI, and DuPont™ Vespel® can all be used at elevated temperatures.