The plastics used for chemical mechanical planarization equipment need to have outstanding chemical resistance and long wear life in abrasive slurries. They also must not generate contamination that can damage semiconductor wafers.
A number of different plastics are used for CPM processes depending on the mechanical property requirements, the chemical environment, the slurry being used, and the desired price point for the component. Curbell supplies a wide range of plastic materials for CMP including polycarbonate and semicrystalline PET, however various grades of PPS and PEEK are most often used for these applications.
The PPS (polyphenylene sulfide) and PEEK (polyetheretherketone) materials used for CMP clamping rings are available in several different formulations. Detailed information on each grade of PPS and PEEK for CMP can be found using the links to each material.
TECATRON® SE– Hardest and stiffest PPS formulation
TECATRON® SX– Longer wearing and tougher than TECATRON® SE
Figure 1: Wear Resistance Comparison of TECATRON® SE and TECATRON® SX
Semi-sperse SS-12 oxide slurry
Rodel CR1C1400-A-3 urethane pad, counter rotating, 150 rpm, 3.8psi
PEEK materials can be used for CMP when greater strength, stiffness, and wear resistance are required. Two grades of PEEK that are used for CMP applications are shown below.
TECAPEEK® SE– Stronger, stiffer, and longer wearing than PPS materials
TECAPEEK® CMP– PEEK formulation with enhanced ductility and wear resistance
Which plastic materials are right for your application? Contact us today.
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